4.1圓柱狀晶體元件的安裝MOUNTING of cylinder type products
(1)爲了避免影響元件電性能或損壞元件,嚴禁將圓柱狀晶體元件外殼焊接在印製板上進行固定。推薦使用橡膠粘結劑進行 固定
Soldering the body of the cylinder type crystal units with PCB must be avoided due to deteriorate the characteristics or damage the products.Rubber adhesive is recommended
(2)當用手工來彎曲引線時,請遵照下列方法When the lead needs to be bent by hand,please follow the instruction as below: 用手指捏住圓柱晶體的外殼;用鑷子夾住引線要彎曲的部位,該部位離晶體基座底部1.5mm以上(推薦3.0mm); 用鑷子夾住彎曲引線成90°,不要用力拉引線。用力拉引線可能造成引線根部的玻璃子破裂,而産生漏氣損壞元件電性能。
Hold the body of the cylinder type crystal unit in fingers; Pick at the part with tweezer,which you want to bend.There should be more than 1.5mm(3.0mm is recommended) from the body case; Bend the lead 90° by tweezer without pulling the lead strongly.If pulling the lead strongly may cause any cracks of hermetic sealing glass at the root of the lead and may cause the leakage and the characteristics to deteriorate. 4.2 SMD晶體元件的安裝MOUNTING of SMD TYPE products
當使用自動安裝設備來裝配SMD晶體元件時,裝配之前要檢測自動安裝設備不會損壞元件。 安裝和焊接晶體元件後,由於機械張力,分裂開整塊線路板産生的線路板的彎曲將造成焊接的脫離或晶體元件封裝的裂開。 請確保晶體元件在線路板上的焊盤位置産生的焊接應力較小和分裂線路板對晶體元件産生的應力較小。
When using an automatic loading machine,please test and confirm to cause no damage to the crystal units before mounting. Bending the circuit board in the process of cleaving boards after mounting and soldering crystal units may cause peeling off the soldering or package cracks by mechanical stress. Please be sure that the layout of crystal products position is on the less sressed and the cleaving process is under less stessed for the crystal units. |